Electrodeposition and characterization of SN-BI lead-free soldier alloys / Goh YingXin

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Electrodeposition and characterization of SN-BI lead-free soldier alloys / Goh YingXin

Tin-bismuth eutectic alloy (Sn-58 wt.% Bi) is emerging as a potential lead-free solder alternative. The low melting temperature (138oC) of this alloy makes it a suitable candidate for higher level interconnections and for soldering heat sensitive components. Demands for high density interconnections...

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Bibliographic Details
Main Author:	Goh, Ying Xin
Format:	Thesis
Published:	2015
Subjects:	T Technology (General) TJ Mechanical engineering and machinery
Online Access:	http://studentsrepo.um.edu.my/7577/ http://studentsrepo.um.edu.my/7577/4/PhD_Thesis_Goh_Yingxin_KHA100056_Minor_Corrections.pdf

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