Bustaman, T. E. (1999). Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman.
Chicago Style (17th ed.) CitationBustaman, Tengku Elisa. Analysis of Foreign Matter Materials Related to the Die Attach Process of Semiconductor Device Packaging / Tengku Elisa Bustaman. 1999.
MLA (9th ed.) CitationBustaman, Tengku Elisa. Analysis of Foreign Matter Materials Related to the Die Attach Process of Semiconductor Device Packaging / Tengku Elisa Bustaman. 1999.
Warning: These citations may not always be 100% accurate.