Effect of heating on bonding characteristics for copper wire bond technology / Gurbinder Singh

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Effect of heating on bonding characteristics for copper wire bond technology / Gurbinder Singh

In recent years, copper has increasingly been used to replace gold to create wire interconnections in microelectronics. While the industry is continuously working on this transition from gold to copper wire to reduce costs, the challenge remain in producing robust and reliable joints for semiconduct...

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Bibliographic Details
Main Author:	Gurbinder , Singh
Format:	Thesis
Published:	2021
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://studentsrepo.um.edu.my/14263/ http://studentsrepo.um.edu.my/14263/2/Gurbinder_Singh.pdf http://studentsrepo.um.edu.my/14263/1/Gurbinder_Singh.pdf

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