APA (7th ed.) Citation

Gurbinder , S. (2021). Effect of heating on bonding characteristics for copper wire bond technology / Gurbinder Singh.

Chicago Style (17th ed.) Citation

Gurbinder , Singh. Effect of Heating on Bonding Characteristics for Copper Wire Bond Technology / Gurbinder Singh. 2021.

MLA (9th ed.) Citation

Gurbinder , Singh. Effect of Heating on Bonding Characteristics for Copper Wire Bond Technology / Gurbinder Singh. 2021.

Warning: These citations may not always be 100% accurate.