Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package / Saif Wakeel

QR Code

Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package / Saif Wakeel

The complexity of cleaning caused by miniaturization of electronic packages and the drive towards cost reduction have recently led to the development of no-clean fluxes (NCF). In this study, characterization and effect of two commercial NCF namely NC-1 and NC-2 on the fine pitch flip-chip package we...

Full description

Bibliographic Details
Main Author:	Saif , Wakeel
Format:	Thesis
Published:	2021
Subjects:	TA Engineering (General). Civil engineering (General)
Online Access:	http://studentsrepo.um.edu.my/13581/ http://studentsrepo.um.edu.my/13581/1/Saif_Wakeel.jpg http://studentsrepo.um.edu.my/13581/8/saif.pdf

Similar Items

Solder Joint Reliability Of Flip Chip BGA Package
by: Lee, Kor Oon
Published: (2004)

Lead Electromigration In Flip Chip Packaging Under Hast Environment
by: Wong, Shaw Hwang
Published: (2004)

Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering
by: Chong, Jia Jun
Published: (2019)

CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods
by: Khor , Chu Yee
Published: (2010)

Numerical Analysis During Encapsulation Process Of Molded Underfill With Multi Flip Chip Package
by: Azmi, Muhammad Afiq
Published: (2018)

Computational Methods In Flip Chip Assembly.
by: Hj Abdul Azid, Assoc. Prof. Dr Ishak, et al.
Published: (2002)

Flip-chip bonding fabrication technique
by: Tengku Azmi, Tengku Muhammad Afif, et al.
Published: (2017)

Co-design/simulation of flip-chip assembly for high voltage IGBT packages
by: Rajaguru, P., et al.
Published: (2017)

Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging
by: Pok, Y., et al.
Published: (2017)

Numerical study of helical savonius rotor in urban areas / Saif Zeyad Mustafa
by: Saif , Zeyad Mustafa
Published: (2011)

Fabrication of micro magnetometer using flip-chip bonding technique
by: Tengku Azmi, Tengku Muhammad Afif, et al.
Published: (2017)

Fabrication of micro magnetometer using flip-chip bonding
by: Tengku Azmi, Tengku Muhammad Afif, et al.
Published: (2017)

High Frequency Signaling Analysis Of Inter-Chip Package Routing For Multi-Chip Package
by: Yong, Khang Choong
Published: (2013)

Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package
by: CHIN, Y, et al.
Published: (2008)

Simulation On Chip Scale Packaging
by: Dorai Raj, Nanthakumar
Published: (2000)

Simulation and fabrication of micro magnetometer using flip-chip bonding technique
by: Tengku Azmi, Tengku Muhammad Afif, et al.
Published: (2017)

Simulation and fabrication of micro magnetometer using flip-chip bonding technique
by: Tengku Azmi, Tengku Muhammad Afif, et al.
Published: (2019)

Metrical analyses of the location of the mandibular canal using CBCT / Saif Yousif Abdullah
by: Abdullah, Saif Yousif
Published: (2011)

Metrical analyses of the location of the mandibular canal using cbct / Saif Yousif Abdullah (latihan)
by: Abdullah, Saif Yousif
Published: (2012)

Variations in the human mandibular canal and foramina: A CBCT study / Saif Yousif Abdullah
by: Saif Yousif , Abdullah
Published: (2017)

Simulation and fabrication of micro magnetometer using flip-chip bonding technique
by: Tengku Azmi, Tengku Muhammad Afif, et al.
Published: (2019)

Understanding the wakeel’s roles of family Takaful as an intermediary at Takaful Ikhlas Sdn Bhd / Mohd Azman Pauzi
by: Pauzi, Mohd Azman
Published: (2011)

Modeling Of Vertical Side Chip Interconnect Technology For 3-Dimensional Packaging
by: Tan , Ai Heong
Published: (2015)

Preparation and characterization of poly (methyl methacrylate) / irradiated - 50% epoxidized natural rubber based solid electrolytes / Zayana Saif
by: Saif, Zayana
Published: (2009)

Developing a framework for English language curriculum evaluation in Oman / Khalid Salim Saif Al-Jardani
by: Al-Jardani, Khalid Salim Saif
Published: (2013)

Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].
by: Goh, Teck Joo
Published: (2004)

An investigation of career decidedness in relation to "big five" personality constructs in adolescence / Muna Saif Abdullah Al-Kalbani
by: Abdullah Al-Kalbani, Muna Saif
Published: (2010)

Effect of Zn nanoparticle-doped ﬂux on mechanical properties of SAC305 solder joint after electromigration
by: Bashir, Muhammad Nasir, et al.
Published: (2023)

Effect of Ni and Co nanoparticle-doped ﬂux on microstructure of SAC305 solder matrix
by: Bashir, Muhammad Nasir, et al.
Published: (2022)

Mel-frequency cepstral and spectral flux analysis of the acoustic signal for real-time status monitoring of laser cleaning
by: Syafiq Ahmad, Abdul Aleem, et al.
Published: (2023)

Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement
by: Chin, Yoong Tatt
Published: (2002)

Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process
by: Nur Afiqqa Rashid,
Published: (2019)

Development and validation of the career decision making indicator (CDMI) using exploratory and confirmatory factor analysis / Muna Saif Abdullah Al-Kalbani
by: Abdullah Al-Kalbani, Muna Saif
Published: (2010)

Thinking and its development approaches: The 2nd third of al-Quran al-Karim as a case study / Galal Abdullah Ahmed Saif
by: Galal Abdullah, Ahmed Saif
Published: (2018)

Design of synchronous serial communication to control pitches of angklung
by: Anas Muzamil, Hamiddin
Published: (2013)

Effect of plant growth regulators on fruit growth and quality development of syzygiumsamarangense (water apple/wax apple) / Adel Mohammed H Al-Saif
by: H Al-Saif, Adel Mohammed
Published: (2011)

Identifying personality traits in Oman high schol students: a test for big five-factor model / Muna Saif Abdullah Al-Kalbani
by: Abdullah Al-Kalbani, Muna Saif
Published: (2010)

Design of synchronous serial communication to control pitches of angklung
by: Anas Muzamil, Hamiddin
Published: (2013)

Effect of plant growth regulators on fruit growth and quality development of syzygium samarangense (water apple/wax apple) / Adel Mohammed H. Al-Saif
by: Al-Saif, Adel Mohammed H.
Published: (2011)

Evaluation of Arabic language textbooks for the second cycle of the basic education in Sultanate of Oman in the light of the modern educational standards / Said Saif Salem al-Amri
by: Said Saif , Salem al-Amri
Published: (2010)