Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino

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Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino

The research is focused on pressure-assisted silver sintering material that is compared to tin silver solder alloy paste as used in power electronics. Material characterization, electrical tests, and reliability tests were conducted in the experiment. After drying process, it was observed that the A...

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Bibliographic Details
Main Author:	Erik Nino, Tolentino
Format:	Thesis
Published:	2020
Subjects:	TA Engineering (General). Civil engineering (General)
Online Access:	http://studentsrepo.um.edu.my/12151/ http://studentsrepo.um.edu.my/12151/1/Erik_Nino_Tolentino.jpg http://studentsrepo.um.edu.my/12151/10/erik.pdf

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