Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / Low Pui Leng

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Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / Low Pui Leng

Tin-silver solder alloy is widely accepted as Pb-free alternative in power electronics. However, this solder alloy cannot meet the requirements of next generation industrial and automotive power drive systems. With the ever-increasing demand for wide bandgap semiconductors with junction temperature...

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Bibliographic Details
Main Author:	Low, Pui Leng
Format:	Thesis
Published:	2019
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://studentsrepo.um.edu.my/11482/ http://studentsrepo.um.edu.my/11482/1/Low_Pui_Leng.jpg http://studentsrepo.um.edu.my/11482/6/pui_leng.pdf

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