Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe

QR Code

Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe

Die attach material plays an important role in electronic packaging as it serves as an interconnection between SiC device and substrate, provides physical and mechanical support and serves as a heat dissipating path. An aluminum-copper (Al-Cu) nanopaste formulated by mixing Al and Cu nanoparticles w...

Full description

Bibliographic Details
Main Author:	Siah, Meng Zhe
Format:	Thesis
Published:	2019
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://studentsrepo.um.edu.my/11396/ http://studentsrepo.um.edu.my/11396/1/Siah_Meng_Zhe.jpg http://studentsrepo.um.edu.my/11396/8/meng_zhe.pdf

Similar Items

Study of copper-aluminium high temperature die-attach material with different aluminium weight percentage /Shiu Kai Ping
by: Shiu , Kai Ping
Published: (2017)

Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
by: Tan , Kim Seah
Published: (2015)

Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
by: Tan , Kim Seah
Published: (2015)

Software risk management tool : the statistical manager / Siah Guat Choon
by: Siah, Guat Choon
Published: (1999)

Study on drawing die radius to load and thinning pattern of aluminium alloy
by: Jamil, Nurul Izzati Mohamad
Published: (2019)

Fabrication And Characterization Of Ag-Al Die Attach Material For Sic-Based High Temperature Device
by: Vemal , Raja Manikam
Published: (2012)

Optimization of silver nanoparticles sizes in ag-cu nanopaste as die-attach materials for high temperature applications
by: Noordin, Norasiah Mohammad
Published: (2017)

Validation study of the Malay version of the 3-minute diagnostic interview for confusion assessment method defined delirium (3D-CAM) / Chin Yi Zhe
by: Chin , Yi Zhe
Published: (2016)

Effect of heat treatment on gravity die-cast Sc-A356 aluminium alloy
by: Lim, Ying Pio*, et al.
Published: (2017)

Characterisation and modelling of static recovery process of Aluminium-copper alloy
by: Mohd Hosni, Ismail
Published: (2008)

Smart learning environment system: e-Commerce module / Saw Yuen Meng @ Chua Yuen Meng
by: Saw @ Chua Yuen Meng, Yuen Meng
Published: (2001)

Mechanical and Fatigue Properties of Gravity Die-Cast A356 Aluminium Alloy with Addition of Scandium
by: A, Masita, et al.
Published: (2019)

Die system design with finite element for improving mechanical performance of extruded aluminium alloys and composites
by: Al-Jaryawy, Hani Mizhir Magid
Published: (2015)

Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / Erik Nino Tolentino
by: Erik Nino, Tolentino
Published: (2020)

Experimental Investigation Of EDM Die Sinking Process Parameters On Aluminium Alloy 5083 Using Design Of Experiment
by: Wahaizad, Safiei, et al.
Published: (2017)

Numerical analysis of time-dependent behavior of Siah Bisheh Cavern
by: Nadimi, S., et al.
Published: (2010)

Desorption of zinc (II) and copper (II) from palm oil fuel ash and activated carbon / by Chong Meng Tuck.
by: Chong, Meng Tuck
Published: (1999)

Improvement of Powermite Package Crack and Chip Die Process Optimization Study in Die Attach and Molding Process
by: Nur Afiqqa Rashid,
Published: (2019)

War and the problem of child soldiers / Yong Meng Yoong.
by: Yong, Meng Yoong
Published: (2002)

Office equipment inventory system / Teh Meng Hai
by: Teh, Meng Hai
Published: (2001)

Process and reliability of die attachment by time-reduced sintering of nanosilver film
by: Dai, Jingru
Published: (2019)

Characterization and mechanical properties of in-situ titanium diboride fibre reinforced aluminium-copper alloy composites
by: Ramli, Rosmamuhamadani
Published: (2016)

Siah Bisheh powerhouse cavern design modification using observational method and back analysis
by: Sharifzadeh, Mostafa, et al.
Published: (2017)

Rights of third parties in insurance law in Malaysia / Chan Wai Meng
by: Chan, Wai Meng
Published: (2007)

Electrocatalysis studies related to [FeFe]-hydrogenase / Woi Pei Meng
by: Woi, Pei Meng
Published: (2011)

A study on the development of the Malaysian debt market / Lee Meng Wai
by: Lee , Meng Wai
Published: (2019)

Accessibility for physically challenged persons in heritage buildings / Phan Meng Hooi
by: Phan, Meng Hooi
Published: (2016)

Quantitative microstructure characterization of Ag nanoparticle sintered joints for power die attachment
by: Wang, Yun, et al.
Published: (2014)

Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling
by: Dai, Jingru, et al.
Published: (2018)

Long term stability assessment of SiahBisheh powerhouse cavernbased on displacement back analysis method
by: Ghorbani, M., et al.
Published: (2009)

Effect of nanofluid-based absorbers on direct solar collector / Tham Chi Meng
by: Tham, Chi Meng
Published: (2011)

Foreign exchange market efficiency : Asia-Pacific focus / Wong Yuen Meng
by: Wong, Yuen Meng
Published: (2013)

The representation of Malaysia in the Philippines media in the Lahad Datu incident / Ng Kit Meng
by: Ng, Kit Meng
Published: (2014)

An analysis of verb form errors of Chinese ESL students / Kam Yong Meng
by: Kam, Yong Meng
Published: (2001)

Slater approximation of Coulomb exchange energy in heavy nuclei / Koh Meng Hock
by: Koh, Meng Hock
Published: (2011)

Import substitution in west malaysia with reference to selected industries / Wong Ah Meng
by: Wong, Ah Meng
Published: (1966)

5th residential college web site development / Goh Wei Meng
by: Goh, Wei Meng
Published: (2001)

Effect of superheating temperatures on microstructure and properties of strontium modified aluminium–silicon eutectic alloy
by: Haque, Md. Mohafizul, et al.
Published: (2005)

The Effect of Direct Thermal Method, Temperature and Time on Microstructure of a Cast Aluminium Alloy
by: Asnul Hadi, Ahmad, et al.
Published: (2014)

Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles
by: Li, Jianfeng, et al.
Published: (2015)