| Summary: | Kelempayan was successfully used in the manufacturing of urea
formaldehyde particleboard at varying target board densities (525
kg/m3, 575 kg/m3 and 665 kg/m3), resin content (6%, 8% and 10%)
with a board thickness of 12 mm. Increasing densities increases all
the board properties significantly in a linear fashion except for
internal bond. An increase in resin content results in a significant
effect on all the board properties. Modulus of rupture (MOR)
increases in a definite trend, internal bond and screw withdrawal
(SW) shows no trend while thickness swelling (TS) decreases. Boards
with density of over 600 kg/m3 and a resin content of 10% meets the
minimum requirements for the strength properties as stipulated in
the BS Standards (BS 5669). However, all boards fail in the thickness
swelling.
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