The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan

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The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan

Due to environmental concerns, lead-free solders were introduced to replace the lead-based solders in microelectronics devices technology. Although there were many lead-free solder available, the Sn-Ag-Cu was considered as the best choice. But the solder has its draw backs in terms of melting temper...

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Bibliographic Details
Main Authors:	Yahya, Iziana, Abd Hamid, Hamidi, Mayappan, Ramani
Format:	Article
Language:	English
Published:	Universiti Teknologi MARA, Perlis 2012
Subjects:	Solder and soldering Metallurgy Powder metallurgy
Online Access:	https://ir.uitm.edu.my/id/eprint/34375/

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