Characterization of defects generated by copper electrochemical plating process on silicon wafers / Yasmin Abdul Wahab

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Characterization of defects generated by copper electrochemical plating process on silicon wafers / Yasmin Abdul Wahab

With the rapid adoption of dual-damascene copper (CuDD) processing as semiconductor device features shrink into deep-submicron process, the copper electrochemical plating (ECP) is emerging as one choice for Cu metallization in multilevel interconnects. Copper processing has brought about an increase...

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Bibliographic Details
Main Author:	Abdul Wahab, Yasmin
Format:	Thesis
Language:	English
Published:	2008
Subjects:	Applications of electric power Electronics
Online Access:	https://ir.uitm.edu.my/id/eprint/27660/

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