Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani

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Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani

Due to the environmental and health concern, the use o f lead free solder has been introduced in 2000 by National Electronics Manufacturing Initiative (NEMI) to replace the tin-lead (Sn-Pb) solder. Among many lead free solders, the tin-silvercopper (Sn-3.5Ag-l.0Cu) is a potential replacement for Sn-...

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Bibliographic Details
Main Author:	Ab Ghani, Noor Asikin
Format:	Thesis
Language:	English
Published:	2016
Subjects:	Electricity and magnetism
Online Access:	https://ir.uitm.edu.my/id/eprint/27206/

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