A Chemically Amplified Fullerene-Derivative Molecular Electron-Beam Resist

Current lithographic resists depend on large polymeric materials, which are starting to limit further improvements in line-width roughness and feature size. Fullerene molecular resists use much smaller molecules to avoid this problem. However, such resists have poor radiation sensitivity. Chemical a...

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Bibliographic Details
Main Authors: Gibbons, Francis, Mohd Zaid, Hasnah, Robinson, A.P.G.
Format: Article
Language:English
Published: 2007
Subjects:
Online Access:http://scholars.utp.edu.my/id/eprint/886/
http://scholars.utp.edu.my/id/eprint/886/1/Small_2007.PDF
Description
Summary:Current lithographic resists depend on large polymeric materials, which are starting to limit further improvements in line-width roughness and feature size. Fullerene molecular resists use much smaller molecules to avoid this problem. However, such resists have poor radiation sensitivity. Chemical amplification of a fullerene derivative using an epoxy crosslinker and a photoacid generator is demonstrated. The sensitivity of the material is increased by two orders of magnitude, and 20-nm line widths are patterned.