Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling
With constraints on size, cost, reliability, and performance for liquid-based cooling systems, the design of modular micropumps suitable for an integrated thermal management system still remains a challenge. In this paper, the effectiveness of a low-cost valveless micropump-heat exchanger on a print...
| Main Authors: | , , |
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| Format: | Citation Index Journal |
| Language: | English |
| Published: |
2009
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| Subjects: | |
| Online Access: | http://scholars.utp.edu.my/id/eprint/279/ http://scholars.utp.edu.my/id/eprint/279/1/paper.pdf |
| _version_ | 1848658949325193216 |
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| author | T., Nagarajan P., Verma D., Chatterjee |
| author_facet | T., Nagarajan P., Verma D., Chatterjee |
| author_sort | T., Nagarajan |
| building | UTP Institutional Repository |
| collection | Online Access |
| description | With constraints on size, cost, reliability, and performance for liquid-based cooling systems, the design of modular micropumps suitable for an integrated thermal management system still remains a challenge. In this paper, the effectiveness of a low-cost valveless micropump-heat exchanger on a printed circuit board is investigated for electronic cooling. Signal conditioning and control electronics are integrated with the fluidic components on the substrate to form a compact modular unit. Piezoelectric actuation and conical diffusers are utilized to generate pulsating flow through a minichannel heat sink. With ethanol as the working fluid, the tested pump reached a maximum flowrate and a pressure head of 2.4 ml/min and 743 Pa at an input voltage of 6 V<sub>DC</sub>. Suitability of the system for active real-time temperature control has been demonstrated at two input heater power levels of 1.45 and 2.5W A maximum reduction of 57 per cent in the average heat sink surface temperature could be achieved at a maximum power consumption of 150 mW by the micropump. © IMechE 2009.
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| first_indexed | 2025-11-13T07:22:39Z |
| format | Citation Index Journal |
| id | oai:scholars.utp.edu.my:279 |
| institution | Universiti Teknologi Petronas |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-13T07:22:39Z |
| publishDate | 2009 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | oai:scholars.utp.edu.my:2792017-01-19T08:25:57Z http://scholars.utp.edu.my/id/eprint/279/ Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling T., Nagarajan P., Verma D., Chatterjee TJ Mechanical engineering and machinery With constraints on size, cost, reliability, and performance for liquid-based cooling systems, the design of modular micropumps suitable for an integrated thermal management system still remains a challenge. In this paper, the effectiveness of a low-cost valveless micropump-heat exchanger on a printed circuit board is investigated for electronic cooling. Signal conditioning and control electronics are integrated with the fluidic components on the substrate to form a compact modular unit. Piezoelectric actuation and conical diffusers are utilized to generate pulsating flow through a minichannel heat sink. With ethanol as the working fluid, the tested pump reached a maximum flowrate and a pressure head of 2.4 ml/min and 743 Pa at an input voltage of 6 V<sub>DC</sub>. Suitability of the system for active real-time temperature control has been demonstrated at two input heater power levels of 1.45 and 2.5W A maximum reduction of 57 per cent in the average heat sink surface temperature could be achieved at a maximum power consumption of 150 mW by the micropump. © IMechE 2009. 2009 Citation Index Journal PeerReviewed application/pdf en http://scholars.utp.edu.my/id/eprint/279/1/paper.pdf T., Nagarajan and P., Verma and D., Chatterjee (2009) Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling. [Citation Index Journal] http://www.scopus.com/inward/record.url?eid=2-s2.0-64549162388&partnerID=40&md5=6b3a42b63f2c9665cebf28094974b410 10.1243/09544062JMES1315 10.1243/09544062JMES1315 10.1243/09544062JMES1315 |
| spellingShingle | TJ Mechanical engineering and machinery T., Nagarajan P., Verma D., Chatterjee Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling |
| title | Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling
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| title_full | Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling
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| title_fullStr | Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling
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| title_full_unstemmed | Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling
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| title_short | Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling
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| title_sort | design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling |
| topic | TJ Mechanical engineering and machinery |
| url | http://scholars.utp.edu.my/id/eprint/279/ http://scholars.utp.edu.my/id/eprint/279/ http://scholars.utp.edu.my/id/eprint/279/ http://scholars.utp.edu.my/id/eprint/279/1/paper.pdf |