Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system

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Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system

A study on reflow soldering process for Sn3.5Ag solder on ENIG substrate was performed using the rapid thermal processing (RTP) system. The reflow soldering process by RTP system can be successful, but it is sensitive to some typical defects. A poor RTP system design can lead to significant temperat...

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Bibliographic Details
Main Authors:	Nor Adhila Muhammad, Badariah Bais, Ibrahim Ahmad
Format:	Article
Language:	English
Published:	Universiti Kebangsaan Malaysia 2014
Online Access:	http://journalarticle.ukm.my/6823/ http://journalarticle.ukm.my/6823/1/15_Nor_Adhila.pdf

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