Effect of Sn plating thickness on wettability, solderability, and electrical connections of electronic lead connectors for surface mount technology applications

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Effect of Sn plating thickness on wettability, solderability, and electrical connections of electronic lead connectors for surface mount technology applications

The wettability of solder is important to achieve good solderability between the electronic component and printed circuit board (PCB). Tin (Sn) plating is widely used to promote the wettability of the solder on the substrates. However, an adequate amount of Sn plating thickness must be taken into co...

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Bibliographic Details
Main Authors:	Maria Abu Bakar, Mohamad Solehin Mohamed Sunar, Azman Jalar, Atiqah, A., Fakhrozi Che Ani, Ibrahym Ahmad, Zol Effendi Zolkefli
Format:	Article
Language:	English
Published:	Penerbit Universiti Kebangsaan Malaysia 2023
Online Access:	http://journalarticle.ukm.my/23254/ http://journalarticle.ukm.my/23254/1/SB%2018.pdf

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