APA (7th ed.) Citation

Maria Abu Bakar, Mohamad Solehin Mohamed Sunar, Azman Jalar, Atiqah, A., Fakhrozi Che Ani, Ibrahym Ahmad, & Zol Effendi Zolkefli. (2023). Effect of Sn plating thickness on wettability, solderability, and electrical connections of electronic lead connectors for surface mount technology applications. Penerbit Universiti Kebangsaan Malaysia.

Chicago Style (17th ed.) Citation

Maria Abu Bakar, Mohamad Solehin Mohamed Sunar, Azman Jalar, A. Atiqah, Fakhrozi Che Ani, Ibrahym Ahmad, and Zol Effendi Zolkefli. Effect of Sn Plating Thickness on Wettability, Solderability, and Electrical Connections of Electronic Lead Connectors for Surface Mount Technology Applications. Penerbit Universiti Kebangsaan Malaysia, 2023.

MLA (9th ed.) Citation

Maria Abu Bakar, et al. Effect of Sn Plating Thickness on Wettability, Solderability, and Electrical Connections of Electronic Lead Connectors for Surface Mount Technology Applications. Penerbit Universiti Kebangsaan Malaysia, 2023.