Copper nanoparticles coating on FTO with improved adhesion using direct and pulse electrodeposition techniques from a simple copper sulphate solution

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Copper nanoparticles coating on FTO with improved adhesion using direct and pulse electrodeposition techniques from a simple copper sulphate solution

Copper (Cu) metal nanoparticles were deposited onto FTO glass using the electrodeposition method. The precursor used was CuSO4 ⋅5H2 O with Na2 SO4 as the inorganic additive. The formation of Cu was characterized using field emission scanning electron microscopy (FESEM), energy-dispersive X-ray spect...

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Bibliographic Details
Main Authors:	Nur Azlina Adris, Lorna Jeffery Minggu, Khuzaimah Arifin, Rozan Mohamad Yunus, Mohamad Azuwa Mohamed, Masliana Muslimin, Mohammad Kassim
Format:	Article
Language:	English
Published:	Penerbit Universiti Kebangsaan Malaysia 2023
Online Access:	http://journalarticle.ukm.my/22886/ http://journalarticle.ukm.my/22886/1/SML%204.pdf

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