APA (7th ed.) Citation

Dafit Feriyanto, Hadi Pranoto, Dedik Romahadi, Imam hidayat, & Spaatz Zakaria. (2023). Compound development of fe80cr20 metallic interconnect by ball milling and ultrasonic technique: Its effect on mass gradation. Penerbit Universiti Kebangsaan Malaysia.

Chicago Style (17th ed.) Citation

Dafit Feriyanto, Hadi Pranoto, Dedik Romahadi, Imam hidayat, and Spaatz Zakaria. Compound Development of Fe80cr20 Metallic Interconnect by Ball Milling and Ultrasonic Technique: Its Effect on Mass Gradation. Penerbit Universiti Kebangsaan Malaysia, 2023.

MLA (9th ed.) Citation

Dafit Feriyanto, et al. Compound Development of Fe80cr20 Metallic Interconnect by Ball Milling and Ultrasonic Technique: Its Effect on Mass Gradation. Penerbit Universiti Kebangsaan Malaysia, 2023.