Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates

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Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates

The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated usi...

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Bibliographic Details
Main Authors:	Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Siti Farahnabilah Muhd Amli, Nurul Razliana Abdul Razak
Format:	Article
Language:	English
Published:	Penerbit Universiti Kebangsaan Malaysia 2020
Online Access:	http://journalarticle.ukm.my/16190/ http://journalarticle.ukm.my/16190/1/36.pdf

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