Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates
The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated usi...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit Universiti Kebangsaan Malaysia
2020
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| Online Access: | http://journalarticle.ukm.my/16190/ http://journalarticle.ukm.my/16190/1/36.pdf |
| _version_ | 1848813989501337600 |
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| author | Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Siti Farahnabilah Muhd Amli, Nurul Razliana Abdul Razak, |
| author_facet | Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Siti Farahnabilah Muhd Amli, Nurul Razliana Abdul Razak, |
| author_sort | Mohd Izrul Izwan Ramli, |
| building | UKM Institutional Repository |
| collection | Online Access |
| description | The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and
microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5,
1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated using the casting process. The result shows that the
influence of 1.5 wt. % Bi in the Sn-0.7Cu solder soldered on copper organic solderability preservative (Cu-OSP) and
immersion tin (Im-Sn) surface finish has improved the wettability and microhardness. Subsequently, the IMC thickness
of Sn-0.7Cu+1.5Bi solder alloy on Im-Sn surface finish gives a better result than reflowed on Cu-OSP. Generally,
with the addition of 1.5 wt. % Bi in Sn-0.7Cu solder alloy reflowed on the Im-Sn surface finish had enhanced the
performance in terms of wettability, thickness of IMC and microhardness properties compared to on Cu-OSP surface
finish. |
| first_indexed | 2025-11-15T00:26:57Z |
| format | Article |
| id | oai:generic.eprints.org:16190 |
| institution | Universiti Kebangasaan Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T00:26:57Z |
| publishDate | 2020 |
| publisher | Penerbit Universiti Kebangsaan Malaysia |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | oai:generic.eprints.org:161902021-02-13T15:11:43Z http://journalarticle.ukm.my/16190/ Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Siti Farahnabilah Muhd Amli, Nurul Razliana Abdul Razak, The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated using the casting process. The result shows that the influence of 1.5 wt. % Bi in the Sn-0.7Cu solder soldered on copper organic solderability preservative (Cu-OSP) and immersion tin (Im-Sn) surface finish has improved the wettability and microhardness. Subsequently, the IMC thickness of Sn-0.7Cu+1.5Bi solder alloy on Im-Sn surface finish gives a better result than reflowed on Cu-OSP. Generally, with the addition of 1.5 wt. % Bi in Sn-0.7Cu solder alloy reflowed on the Im-Sn surface finish had enhanced the performance in terms of wettability, thickness of IMC and microhardness properties compared to on Cu-OSP surface finish. Penerbit Universiti Kebangsaan Malaysia 2020-12 Article PeerReviewed application/pdf en http://journalarticle.ukm.my/16190/1/36.pdf Mohd Izrul Izwan Ramli, and Mohd Arif Anuar Mohd Salleh, and Siti Farahnabilah Muhd Amli, and Nurul Razliana Abdul Razak, (2020) Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates. Sains Malaysiana, 49 (12). pp. 3255-3259. ISSN 0126-6039 https://www.ukm.my/jsm/malay_journals/jilid49bil12_2020/KandunganJilid49Bil12_2020.html |
| spellingShingle | Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Siti Farahnabilah Muhd Amli, Nurul Razliana Abdul Razak, Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates |
| title | Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates |
| title_full | Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates |
| title_fullStr | Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates |
| title_full_unstemmed | Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates |
| title_short | Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates |
| title_sort | effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of sn-0.7cu on different surface finish substrates |
| url | http://journalarticle.ukm.my/16190/ http://journalarticle.ukm.my/16190/ http://journalarticle.ukm.my/16190/1/36.pdf |