Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS)

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Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS)

This study aims to evaluate the effect of copper (Cu) substrate surface roughness on the intermetallic compound (IMC) growth and interfacial reaction of SAC305 lead-free solder joint after undergone an aging process. Aging process was conducted using high temperature storage (HTS) at temperature o...

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Bibliographic Details
Main Authors:	Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin, Kim, Siow Shyong
Format:	Article
Language:	English
Published:	Penerbit Universiti Kebangsaan Malaysia 2020
Online Access:	http://journalarticle.ukm.my/16169/ http://journalarticle.ukm.my/16169/1/16.pdf

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