APA (7th ed.) Citation

Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin, & Kim, S. S. (2020). Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS). Penerbit Universiti Kebangsaan Malaysia.

Chicago Style (17th ed.) Citation

Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin, and Siow Shyong Kim. Effect of Isothermal Aging and Copper Substrate Roughness on the SAC305 Solder Joint Intermetallic Layer Growth of High Temperature Storage (HTS). Penerbit Universiti Kebangsaan Malaysia, 2020.

MLA (9th ed.) Citation

Rabiah Al Adawiyah Ab Rahim, et al. Effect of Isothermal Aging and Copper Substrate Roughness on the SAC305 Solder Joint Intermetallic Layer Growth of High Temperature Storage (HTS). Penerbit Universiti Kebangsaan Malaysia, 2020.