Effect of coating element on joining stability of Sn-0.3Ag-0.7Cu solder joint due to aging test

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Effect of coating element on joining stability of Sn-0.3Ag-0.7Cu solder joint due to aging test

Solder joint is important for providing mechanical support and functionality of electronic packaging. Established solder joint should be able to withstand in device service operation and the environment without significant changes in terms of their microstructural evolution and mechanical properti...

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Bibliographic Details
Main Authors:	Atiqah Mohd Afdzaluddin, Maria Abu Bakar
Format:	Article
Language:	English
Published:	Penerbit Universiti Kebangsaan Malaysia 2020
Online Access:	http://journalarticle.ukm.my/16167/ http://journalarticle.ukm.my/16167/1/14.pdf

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