Atiqah Mohd Afdzaluddin & Maria Abu Bakar. (2020). Effect of coating element on joining stability of Sn-0.3Ag-0.7Cu solder joint due to aging test. Penerbit Universiti Kebangsaan Malaysia.
Chicago Style (17th ed.) CitationAtiqah Mohd Afdzaluddin and Maria Abu Bakar. Effect of Coating Element on Joining Stability of Sn-0.3Ag-0.7Cu Solder Joint Due to Aging Test. Penerbit Universiti Kebangsaan Malaysia, 2020.
MLA (9th ed.) CitationAtiqah Mohd Afdzaluddin and Maria Abu Bakar. Effect of Coating Element on Joining Stability of Sn-0.3Ag-0.7Cu Solder Joint Due to Aging Test. Penerbit Universiti Kebangsaan Malaysia, 2020.
Warning: These citations may not always be 100% accurate.