Near-field MIMO for wireless communication in complex propagation environments

Communication between chips on integrated packages takes place using conducting wires, vias, microwave transmission lines, inductive and capacitive coupling. Inductive and capacitive coupling for data transfer is impractical for high data rate chip-to-chip communication because of limited scalabilit...

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Bibliographic Details
Main Author: Lodro, Mir
Format: Thesis (University of Nottingham only)
Language:English
Published: 2021
Subjects:
Online Access:https://eprints.nottingham.ac.uk/67083/

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