Near-field MIMO for wireless communication in complex propagation environments
Communication between chips on integrated packages takes place using conducting wires, vias, microwave transmission lines, inductive and capacitive coupling. Inductive and capacitive coupling for data transfer is impractical for high data rate chip-to-chip communication because of limited scalabilit...
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| Format: | Thesis (University of Nottingham only) |
| Language: | English |
| Published: |
2021
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| Online Access: | https://eprints.nottingham.ac.uk/67083/ |