Highly ordered BN ⊥ –BN ⊥ stacking structure for improved thermally conductive polymer composites
The substantial heat generation in modern electronic devices is one of the major issues requiring efficient thermal management. This work demonstrates a novel concept for the design of thermally conducting networks inside a polymer matrix for the development of highly thermally conductive composites...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
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Blackwell Publishing Ltd
2020
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| Online Access: | https://eprints.nottingham.ac.uk/63625/ |
| _version_ | 1848800042856480768 |
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| author | Ghosh, Barun Xu, Fang Grant, David M. Giangrande, Paolo Gerada, Chris George, Michael W. Hou, Xianghui |
| author_facet | Ghosh, Barun Xu, Fang Grant, David M. Giangrande, Paolo Gerada, Chris George, Michael W. Hou, Xianghui |
| author_sort | Ghosh, Barun |
| building | Nottingham Research Data Repository |
| collection | Online Access |
| description | The substantial heat generation in modern electronic devices is one of the major issues requiring efficient thermal management. This work demonstrates a novel concept for the design of thermally conducting networks inside a polymer matrix for the development of highly thermally conductive composites. Highly ordered hexagonal boron nitride (hBN) structures are obtained utilizing a freeze-casting method. These structures are then thermally sintered to get a continuous network of BN⊥–BN⊥ of high thermal conductivity in which a polymer matrix can be impregnated, enabling a directional and thermally conducting composite. The highest achieved thermal conductivity (K) is 4.38 W m−1 K−1 with a BN loading of 32 vol%. The effect of sintering temperatures on the K of the composite is investigated to optimize connectivity and thermal pathways while maintaining an open structure (porosity ≈ 2.7%). The composites also maintain good electrical insulation (volume resistivity ≈ 1014 Ω cm). This new approach of thermally sintering BN⊥–BN⊥ aligned structures opens up a new avenue for the design and preparation of filler alignment in polymer-based composites for improving the thermal conductivity while maintaining high electrical resistance, which is a topic of interest in electronic packaging and power electronics applications. |
| first_indexed | 2025-11-14T20:45:16Z |
| format | Article |
| id | nottingham-63625 |
| institution | University of Nottingham Malaysia Campus |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T20:45:16Z |
| publishDate | 2020 |
| publisher | Blackwell Publishing Ltd |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | nottingham-636252020-10-27T02:19:04Z https://eprints.nottingham.ac.uk/63625/ Highly ordered BN ⊥ –BN ⊥ stacking structure for improved thermally conductive polymer composites Ghosh, Barun Xu, Fang Grant, David M. Giangrande, Paolo Gerada, Chris George, Michael W. Hou, Xianghui The substantial heat generation in modern electronic devices is one of the major issues requiring efficient thermal management. This work demonstrates a novel concept for the design of thermally conducting networks inside a polymer matrix for the development of highly thermally conductive composites. Highly ordered hexagonal boron nitride (hBN) structures are obtained utilizing a freeze-casting method. These structures are then thermally sintered to get a continuous network of BN⊥–BN⊥ of high thermal conductivity in which a polymer matrix can be impregnated, enabling a directional and thermally conducting composite. The highest achieved thermal conductivity (K) is 4.38 W m−1 K−1 with a BN loading of 32 vol%. The effect of sintering temperatures on the K of the composite is investigated to optimize connectivity and thermal pathways while maintaining an open structure (porosity ≈ 2.7%). The composites also maintain good electrical insulation (volume resistivity ≈ 1014 Ω cm). This new approach of thermally sintering BN⊥–BN⊥ aligned structures opens up a new avenue for the design and preparation of filler alignment in polymer-based composites for improving the thermal conductivity while maintaining high electrical resistance, which is a topic of interest in electronic packaging and power electronics applications. Blackwell Publishing Ltd 2020-10-08 Article PeerReviewed application/pdf en cc_by https://eprints.nottingham.ac.uk/63625/1/Highly%20Ordered%20BN.pdf Ghosh, Barun, Xu, Fang, Grant, David M., Giangrande, Paolo, Gerada, Chris, George, Michael W. and Hou, Xianghui (2020) Highly ordered BN ⊥ –BN ⊥ stacking structure for improved thermally conductive polymer composites. Advanced Electronic Materials . p. 2000627. ISSN 2199-160X filler alignments; hexagonal boron nitride; high-temperature sintering; polymer composites; thermal conductivity http://dx.doi.org/10.1002/aelm.202000627 doi:10.1002/aelm.202000627 doi:10.1002/aelm.202000627 |
| spellingShingle | filler alignments; hexagonal boron nitride; high-temperature sintering; polymer composites; thermal conductivity Ghosh, Barun Xu, Fang Grant, David M. Giangrande, Paolo Gerada, Chris George, Michael W. Hou, Xianghui Highly ordered BN ⊥ –BN ⊥ stacking structure for improved thermally conductive polymer composites |
| title | Highly ordered BN ⊥ –BN ⊥ stacking structure for improved thermally conductive polymer composites |
| title_full | Highly ordered BN ⊥ –BN ⊥ stacking structure for improved thermally conductive polymer composites |
| title_fullStr | Highly ordered BN ⊥ –BN ⊥ stacking structure for improved thermally conductive polymer composites |
| title_full_unstemmed | Highly ordered BN ⊥ –BN ⊥ stacking structure for improved thermally conductive polymer composites |
| title_short | Highly ordered BN ⊥ –BN ⊥ stacking structure for improved thermally conductive polymer composites |
| title_sort | highly ordered bn ⊥ –bn ⊥ stacking structure for improved thermally conductive polymer composites |
| topic | filler alignments; hexagonal boron nitride; high-temperature sintering; polymer composites; thermal conductivity |
| url | https://eprints.nottingham.ac.uk/63625/ https://eprints.nottingham.ac.uk/63625/ https://eprints.nottingham.ac.uk/63625/ |