Skip to content
VuFind
Advanced
  • Reactive material jetting of p...
  • Cite this
  • Print
  • Export Record
    • Export to RefWorks
    • Export to EndNoteWeb
    • Export to EndNote
Export Ready — 
Reactive material jetting of polyimide insulators for
complex circuit board design
QR Code

Reactive material jetting of polyimide insulators for complex circuit board design

Bibliographic Details
Main Authors: Zhang, Fan, Saleh, Ehab, Vaithilingam, Jayasheelan, Li, You, Tuck, Christopher, Hague, Richard, Wildman, Ricky, He, Yinfeng
Format: Article
Language:English
Published: Elsevier 2019
Online Access:https://eprints.nottingham.ac.uk/55709/
  • Holdings
  • Description
  • Similar Items
  • Staff View

Internet

https://eprints.nottingham.ac.uk/55709/

Similar Items

  • Inkjet printing of polyimide insulators for the 3D printing of dielectric materials for microelectronic applications
    by: Zhang, Fan, et al.
    Published: (2016)
  • A tripropylene glycol diacrylate-based polymeric support ink for material jetting
    by: He, Yinfeng, et al.
    Published: (2017)
  • Optimisation of substrate angles for multi-material and multi-functional inkjet printing
    by: Vaithilingam, Jayasheelan, et al.
    Published: (2018)
  • 3D inkjet printing of electronics using UV conversion
    by: Saleh, Ehab, et al.
    Published: (2017)
  • An investigation of the behavior of solvent based polycaprolactone ink for material jetting
    by: He, Yinfeng, et al.
    Published: (2016)

Search Options

  • Advanced Search

Find More

  • Browse the Catalog

Need Help?

  • Search Tips