Individual device active cooling for enhanced system-level power density and more uniform temperature distribution

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Individual device active cooling for enhanced system-level power density and more uniform temperature distribution

This paper provides a method of individual device active cooling system to balance the temperature distribution of system-level power density. 3L-ANPC GaN inverter was used to test and prove the feasibility of it in using multi-level systems.

Bibliographic Details
Main Authors:	Zeng, Y., Hussein, A., Castellazzi, A.
Format:	Conference or Workshop Item
Language:	English
Published:	2018
Subjects:	Individual active cooling system GaN HEMT 3LANPC inverter
Online Access:	https://eprints.nottingham.ac.uk/54142/

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