APA (7th ed.) Citation

Yang, L., Agyakwa, P., Corfield, M., Johnson, M., Harris, A., Packwood, M., & Paciura, K. (2018). Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules.

Chicago Style (17th ed.) Citation

Yang, Li, Pearl Agyakwa, Martin Corfield, Mark Johnson, Anne Harris, Matthew Packwood, and Krzysztof Paciura. Comparison of Thermal and Reliability Performance Between a SiC MOSFET Module with Embedded Decoupling Capacitors and Commercial Si IGBT Power Modules. 2018.

MLA (9th ed.) Citation

Yang, Li, et al. Comparison of Thermal and Reliability Performance Between a SiC MOSFET Module with Embedded Decoupling Capacitors and Commercial Si IGBT Power Modules. 2018.