Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables

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Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables

An effort to design and build a prototype LED driver system which is energy efficient, highly compact and with few component count was initiated by a consortium UK universities. The prototype system will be based on Silicon Lateral IGBT (LIGBT) device combined with chip on board technology. Part oft...

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Bibliographic Details
Main Authors:	Rajaguru, P., Lu, H., Bailey, C., Castellazzi, A., Pathirana, V., Udugampola, N., Udrea, F.
Format:	Article
Published:	Elsevier 2018
Online Access:	https://eprints.nottingham.ac.uk/51681/

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