APA (7th ed.) Citation

Rajaguru, P., Lu, H., Bailey, C., Castellazzi, A., Pathirana, V., Udugampola, N., & Udrea, F. (2018). Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Elsevier.

Chicago Style (17th ed.) Citation

Rajaguru, P., H. Lu, C. Bailey, A. Castellazzi, V. Pathirana, N. Udugampola, and F. Udrea. Impact of Underfill and Other Physical Dimensions on Silicon Lateral IGBT Package Reliability Using Computer Model with Discrete and Continuous Design Variables. Elsevier, 2018.

MLA (9th ed.) Citation

Rajaguru, P., et al. Impact of Underfill and Other Physical Dimensions on Silicon Lateral IGBT Package Reliability Using Computer Model with Discrete and Continuous Design Variables. Elsevier, 2018.