Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: effect of pin-fin diameter

This experimental study presents the parametric analysis for the round pin-finned heat sinks subjected to steady heat densities for effective and reliable cooling of mobile electronic devices. Phase change material (PCM) namely paraffin wax is adopted as energy storage material and aluminum made rou...

Full description

Bibliographic Details
Main Authors: Arshad, Adeel, Ali, Hafiz Muhammad, Khushnood, Shahab, Jabbal, Mark
Format: Article
Published: Elsevier 2017
Subjects:
Online Access:https://eprints.nottingham.ac.uk/47365/
_version_ 1848797527638278144
author Arshad, Adeel
Ali, Hafiz Muhammad
Khushnood, Shahab
Jabbal, Mark
author_facet Arshad, Adeel
Ali, Hafiz Muhammad
Khushnood, Shahab
Jabbal, Mark
author_sort Arshad, Adeel
building Nottingham Research Data Repository
collection Online Access
description This experimental study presents the parametric analysis for the round pin-finned heat sinks subjected to steady heat densities for effective and reliable cooling of mobile electronic devices. Phase change material (PCM) namely paraffin wax is adopted as energy storage material and aluminum made round pin-fins are selected as thermal conductivity enhancers (TCEs). A constant volume fraction of 9% of round pin-fins is selected with pin diameter of 2
first_indexed 2025-11-14T20:05:18Z
format Article
id nottingham-47365
institution University of Nottingham Malaysia Campus
institution_category Local University
last_indexed 2025-11-14T20:05:18Z
publishDate 2017
publisher Elsevier
recordtype eprints
repository_type Digital Repository
spelling nottingham-473652020-05-04T19:13:12Z https://eprints.nottingham.ac.uk/47365/ Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: effect of pin-fin diameter Arshad, Adeel Ali, Hafiz Muhammad Khushnood, Shahab Jabbal, Mark This experimental study presents the parametric analysis for the round pin-finned heat sinks subjected to steady heat densities for effective and reliable cooling of mobile electronic devices. Phase change material (PCM) namely paraffin wax is adopted as energy storage material and aluminum made round pin-fins are selected as thermal conductivity enhancers (TCEs). A constant volume fraction of 9% of round pin-fins is selected with pin diameter of 2 Elsevier 2017-10-21 Article PeerReviewed Arshad, Adeel, Ali, Hafiz Muhammad, Khushnood, Shahab and Jabbal, Mark (2017) Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: effect of pin-fin diameter. International Journal of Heat and Mass Transfer, 117 . pp. 861-872. ISSN 0017-9310 Round pin-fin; Heat Sink; Phase Change Material; Thermal Conductivity Enhancers; Paraffin Wax; set point temperatures; Enhancement Ratio; Heat capacity; Thermal Conductance http://www.sciencedirect.com/science/article/pii/S0017931017328107 doi:10.1016/j.ijheatmasstransfer.2017.10.008 doi:10.1016/j.ijheatmasstransfer.2017.10.008
spellingShingle Round pin-fin; Heat Sink; Phase Change Material; Thermal Conductivity Enhancers; Paraffin Wax; set point temperatures; Enhancement Ratio; Heat capacity; Thermal Conductance
Arshad, Adeel
Ali, Hafiz Muhammad
Khushnood, Shahab
Jabbal, Mark
Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: effect of pin-fin diameter
title Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: effect of pin-fin diameter
title_full Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: effect of pin-fin diameter
title_fullStr Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: effect of pin-fin diameter
title_full_unstemmed Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: effect of pin-fin diameter
title_short Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: effect of pin-fin diameter
title_sort experimental investigation of pcm based round pin-fin heat sinks for thermal management of electronics: effect of pin-fin diameter
topic Round pin-fin; Heat Sink; Phase Change Material; Thermal Conductivity Enhancers; Paraffin Wax; set point temperatures; Enhancement Ratio; Heat capacity; Thermal Conductance
url https://eprints.nottingham.ac.uk/47365/
https://eprints.nottingham.ac.uk/47365/
https://eprints.nottingham.ac.uk/47365/