Pressure contact multi-chip packaging of SiC
Schottky diodes

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Pressure contact multi-chip packaging of SiC Schottky diodes

Pressure contact packages have demonstrated an improved reliability for silicon devices due to the elimination of the weak elements of the packaging, namely wirebonds and solder. This packaging approach has not yet been widely studied for SiC devices, however, it is of high interest for applications...

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Bibliographic Details
Main Authors:	Gonzalez, Jose Ortiz, Alatise, Olayiwola, Mawby, Philip, Aliyu, Attahir Murtala, Castellazzi, Alberto
Format:	Conference or Workshop Item
Published:	2017
Subjects:	Pressure contacts Press-pack Silicon
Online Access:	https://eprints.nottingham.ac.uk/47025/

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