Pressure contact multi-chip packaging of SiC Schottky diodes
Pressure contact packages have demonstrated an improved reliability for silicon devices due to the elimination of the weak elements of the packaging, namely wirebonds and solder. This packaging approach has not yet been widely studied for SiC devices, however, it is of high interest for applications...
| Main Authors: | , , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2017
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| Online Access: | https://eprints.nottingham.ac.uk/47025/ |
| _version_ | 1848797451650072576 |
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| author | Gonzalez, Jose Ortiz Alatise, Olayiwola Mawby, Philip Aliyu, Attahir Murtala Castellazzi, Alberto |
| author_facet | Gonzalez, Jose Ortiz Alatise, Olayiwola Mawby, Philip Aliyu, Attahir Murtala Castellazzi, Alberto |
| author_sort | Gonzalez, Jose Ortiz |
| building | Nottingham Research Data Repository |
| collection | Online Access |
| description | Pressure contact packages have demonstrated an improved reliability for silicon devices due to the elimination of the weak elements of the packaging, namely wirebonds and solder. This packaging approach has not yet been widely studied for SiC devices, however, it is of high interest for applications like HVDC or rail traction, where the wide bandgap properties of SiC devices can be fully exploited and high reliability is critical. Current IGBT press-pack modules use Si PiN diodes for enabling reverse conduction, however, the use of SiC Schottky diodes would be beneficial given their better characteristics including low switching losses and lower zero temperature coefficient (ZTC) for electrothermal stability of diodes in parallel. A prototype for the evaluation of SiC Schottky diodes using pressure contacts has been designed, built and tested for both single die and multiple die. |
| first_indexed | 2025-11-14T20:04:05Z |
| format | Conference or Workshop Item |
| id | nottingham-47025 |
| institution | University of Nottingham Malaysia Campus |
| institution_category | Local University |
| last_indexed | 2025-11-14T20:04:05Z |
| publishDate | 2017 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | nottingham-470252020-05-04T18:56:50Z https://eprints.nottingham.ac.uk/47025/ Pressure contact multi-chip packaging of SiC Schottky diodes Gonzalez, Jose Ortiz Alatise, Olayiwola Mawby, Philip Aliyu, Attahir Murtala Castellazzi, Alberto Pressure contact packages have demonstrated an improved reliability for silicon devices due to the elimination of the weak elements of the packaging, namely wirebonds and solder. This packaging approach has not yet been widely studied for SiC devices, however, it is of high interest for applications like HVDC or rail traction, where the wide bandgap properties of SiC devices can be fully exploited and high reliability is critical. Current IGBT press-pack modules use Si PiN diodes for enabling reverse conduction, however, the use of SiC Schottky diodes would be beneficial given their better characteristics including low switching losses and lower zero temperature coefficient (ZTC) for electrothermal stability of diodes in parallel. A prototype for the evaluation of SiC Schottky diodes using pressure contacts has been designed, built and tested for both single die and multiple die. 2017-07-24 Conference or Workshop Item PeerReviewed Gonzalez, Jose Ortiz, Alatise, Olayiwola, Mawby, Philip, Aliyu, Attahir Murtala and Castellazzi, Alberto (2017) Pressure contact multi-chip packaging of SiC Schottky diodes. In: 29th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2017), 28 May - 1 June 2017, Sapporo, Japan. Pressure contacts Press-pack Silicon http://ieeexplore.ieee.org/document/7988977/ |
| spellingShingle | Pressure contacts Press-pack Silicon Gonzalez, Jose Ortiz Alatise, Olayiwola Mawby, Philip Aliyu, Attahir Murtala Castellazzi, Alberto Pressure contact multi-chip packaging of SiC Schottky diodes |
| title | Pressure contact multi-chip packaging of SiC
Schottky diodes |
| title_full | Pressure contact multi-chip packaging of SiC
Schottky diodes |
| title_fullStr | Pressure contact multi-chip packaging of SiC
Schottky diodes |
| title_full_unstemmed | Pressure contact multi-chip packaging of SiC
Schottky diodes |
| title_short | Pressure contact multi-chip packaging of SiC
Schottky diodes |
| title_sort | pressure contact multi-chip packaging of sic
schottky diodes |
| topic | Pressure contacts Press-pack Silicon |
| url | https://eprints.nottingham.ac.uk/47025/ https://eprints.nottingham.ac.uk/47025/ |