Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch

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Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch

The aim of this work is the thermal design of a modular direct liquid cooled package for 1200 V–35 A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters....

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Bibliographic Details
Main Authors:	Cova, P., Aliyu, Attahir Murtala, Castellazzi, Alberto, Chiozzi, D., Delmonte, N., Lasserre, P., Pignoloni, N.
Format:	Article
Published:	Elsevier 2017
Subjects:	High power density; Packaging; System integration; Thermal design; Liquid cooling
Online Access:	https://eprints.nottingham.ac.uk/44221/

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