Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch

Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch

The aim of this work is the thermal design of a modular direct liquid cooled package for 1200 V–35 A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters....

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Bibliographic Details
Main Authors: Cova, P., Aliyu, Attahir Murtala, Castellazzi, Alberto, Chiozzi, D., Delmonte, N., Lasserre, P., Pignoloni, N.
Format: Article
Published: Elsevier 2017
Subjects:
High power density; Packaging; System integration; Thermal design; Liquid cooling
Online Access:https://eprints.nottingham.ac.uk/44221/
Description
Summary:The aim of this work is the thermal design of a modular direct liquid cooled package for 1200 V–35 A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters. An accurate electro-thermal fluid dynamic model is set up and validated by thermal characterization on a prototype; numerical models have been used to study the internal temperature distribution and to propose further optimization.

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