3D inkjet printing of electronics using UV conversion
The production of electronic circuits and devices is limited by current manufacturing methods that limit both the form and potentially the performance of these systems. Additive Manufacturing (AM) is a technology that has been shown to provide cross sectoral manufacturing industries with significant...
| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Published: |
Wiley
2017
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| Online Access: | https://eprints.nottingham.ac.uk/44023/ |
| _version_ | 1848796819766640640 |
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| author | Saleh, Ehab Zhang, Fan He, Yinfeng Vaithilingam, Jayasheelan Fernandez, Javier Ledesma Wildman, Ricky D. Ashcroft, Ian Hague, Richard J.M. Dickens, Phill Tuck, Christopher |
| author_facet | Saleh, Ehab Zhang, Fan He, Yinfeng Vaithilingam, Jayasheelan Fernandez, Javier Ledesma Wildman, Ricky D. Ashcroft, Ian Hague, Richard J.M. Dickens, Phill Tuck, Christopher |
| author_sort | Saleh, Ehab |
| building | Nottingham Research Data Repository |
| collection | Online Access |
| description | The production of electronic circuits and devices is limited by current manufacturing methods that limit both the form and potentially the performance of these systems. Additive Manufacturing (AM) is a technology that has been shown to provide cross sectoral manufacturing industries with significant geometrical freedom. A research domain known as Multi-Functional Additive Manufacturing (MFAM) in its infancy looks to couple the positive attributes of AM with application in the electronics sector could have a significant impact on the development of new products, however there are significant hurdles to overcome. This paper reports on the single step MFAM of three dimensional (3D) electronic circuitry within a polymeric structure using a combination of conductive and non-conductive materials within a single material jetting based AM system. The basis of this breakthrough is a study of the optical absorption regions of a silver nanoparticle (AgNP) conductive ink which lead to a novel method to rapidly process and sinter silver nanoparticle inks in ambient conditions using simple UV radiation contemporaneously with UV-curing of deposited polymeric structures. |
| first_indexed | 2025-11-14T19:54:03Z |
| format | Article |
| id | nottingham-44023 |
| institution | University of Nottingham Malaysia Campus |
| institution_category | Local University |
| last_indexed | 2025-11-14T19:54:03Z |
| publishDate | 2017 |
| publisher | Wiley |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | nottingham-440232020-05-04T19:55:23Z https://eprints.nottingham.ac.uk/44023/ 3D inkjet printing of electronics using UV conversion Saleh, Ehab Zhang, Fan He, Yinfeng Vaithilingam, Jayasheelan Fernandez, Javier Ledesma Wildman, Ricky D. Ashcroft, Ian Hague, Richard J.M. Dickens, Phill Tuck, Christopher The production of electronic circuits and devices is limited by current manufacturing methods that limit both the form and potentially the performance of these systems. Additive Manufacturing (AM) is a technology that has been shown to provide cross sectoral manufacturing industries with significant geometrical freedom. A research domain known as Multi-Functional Additive Manufacturing (MFAM) in its infancy looks to couple the positive attributes of AM with application in the electronics sector could have a significant impact on the development of new products, however there are significant hurdles to overcome. This paper reports on the single step MFAM of three dimensional (3D) electronic circuitry within a polymeric structure using a combination of conductive and non-conductive materials within a single material jetting based AM system. The basis of this breakthrough is a study of the optical absorption regions of a silver nanoparticle (AgNP) conductive ink which lead to a novel method to rapidly process and sinter silver nanoparticle inks in ambient conditions using simple UV radiation contemporaneously with UV-curing of deposited polymeric structures. Wiley 2017-10 Article PeerReviewed Saleh, Ehab, Zhang, Fan, He, Yinfeng, Vaithilingam, Jayasheelan, Fernandez, Javier Ledesma, Wildman, Ricky D., Ashcroft, Ian, Hague, Richard J.M., Dickens, Phill and Tuck, Christopher (2017) 3D inkjet printing of electronics using UV conversion. Advanced Materials Technologies, 2 (10). 1700134/1-1700134/8. ISSN 2365-709X additive manufacturing UV sintering conductive ink polymeric ink http://onlinelibrary.wiley.com/doi/10.1002/admt.201700134/abstract doi:10.1002/admt.201700134 doi:10.1002/admt.201700134 |
| spellingShingle | additive manufacturing UV sintering conductive ink polymeric ink Saleh, Ehab Zhang, Fan He, Yinfeng Vaithilingam, Jayasheelan Fernandez, Javier Ledesma Wildman, Ricky D. Ashcroft, Ian Hague, Richard J.M. Dickens, Phill Tuck, Christopher 3D inkjet printing of electronics using UV conversion |
| title | 3D inkjet printing of electronics using UV conversion |
| title_full | 3D inkjet printing of electronics using UV conversion |
| title_fullStr | 3D inkjet printing of electronics using UV conversion |
| title_full_unstemmed | 3D inkjet printing of electronics using UV conversion |
| title_short | 3D inkjet printing of electronics using UV conversion |
| title_sort | 3d inkjet printing of electronics using uv conversion |
| topic | additive manufacturing UV sintering conductive ink polymeric ink |
| url | https://eprints.nottingham.ac.uk/44023/ https://eprints.nottingham.ac.uk/44023/ https://eprints.nottingham.ac.uk/44023/ |