Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules

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Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules

SiC is a wide bandgap semiconductor with better electrothermal properties than silicon, including higher temperature of operation, higher breakdown voltage, lower losses and the ability to switch at higher frequencies. However, the power cycling performance of SiC devices in traditional silicon pack...

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Bibliographic Details
Main Authors:	Ortiz Gonzalez, J., Aliyu, Attahir Murtala, Alatise, O., Castellazzi, Alberto, Ran, L., Mawby, P.
Format:	Article
Published:	Elsevier 2016
Subjects:	SiC Aluminium graphite Pressure packaging
Online Access:	https://eprints.nottingham.ac.uk/43856/

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