Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior

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Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior

Insulated gate bipolar transistor (IGBT) modules, which can fail to stable short-circuit mode, have major applications in electricity network-related fields. Sn-3.5Ag solder joints and sintered Ag joints for the die attachment and Mo, Cu, Sn-3.5Ag, Al, and Ag foils for the top side insert (TSI) mate...

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Bibliographic Details
Main Authors:	Li, Jianfeng, Yaqub, Imran, Corfield, Martin, Johnson, Christopher Mark
Format:	Article
Published:	Institute of Electrical and Electronics Engineers 2017
Subjects:	Electronics packaging Failure to short circuit Finite element analysis Overcurrent failure Power module Scanning electronic microscopy Semiconductor device packaging
Online Access:	https://eprints.nottingham.ac.uk/41475/

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