APA (7th ed.) Citation

Li, J., Yaqub, I., Corfield, M., & Johnson, C. M. (2017). Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior. Institute of Electrical and Electronics Engineers.

Chicago Style (17th ed.) Citation

Li, Jianfeng, Imran Yaqub, Martin Corfield, and Christopher Mark Johnson. Interconnect Materials Enabling IGBT Modules to Achieve Stable Short Circuit Failure Behavior. Institute of Electrical and Electronics Engineers, 2017.

MLA (9th ed.) Citation

Li, Jianfeng, et al. Interconnect Materials Enabling IGBT Modules to Achieve Stable Short Circuit Failure Behavior. Institute of Electrical and Electronics Engineers, 2017.