In-service diagnostics for wire-bond lift-off and solder fatigue of power semiconductor packages

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In-service diagnostics for wire-bond lift-off and solder fatigue of power semiconductor packages

Wire-bond lift-off and Solder fatigue are degradation mechanisms that dominate the lifetime of power semiconductor packages. Although their lifetime is commonly estimated at the design stage, based on mission profiles and Physics-of-Failure models, there are many uncertainties associated with such l...

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Bibliographic Details
Main Authors:	Eleffendi, Mohd Amir, Johnson, Christopher Mark
Format:	Article
Published:	IEEE 2017
Subjects:	Reliability Kalman Filtering Least squares methods IGBT Monitoring Life estimation
Online Access:	https://eprints.nottingham.ac.uk/39589/

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