Eleffendi, M. A., & Johnson, C. M. (2017). In-service diagnostics for wire-bond lift-off and solder fatigue of power semiconductor packages. IEEE.
Chicago Style (17th ed.) CitationEleffendi, Mohd Amir, and Christopher Mark Johnson. In-service Diagnostics for Wire-bond Lift-off and Solder Fatigue of Power Semiconductor Packages. IEEE, 2017.
MLA (9th ed.) CitationEleffendi, Mohd Amir, and Christopher Mark Johnson. In-service Diagnostics for Wire-bond Lift-off and Solder Fatigue of Power Semiconductor Packages. IEEE, 2017.
Warning: These citations may not always be 100% accurate.