A thermal cycling reliability study of ultrasonically bonded copper wires

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A thermal cycling reliability study of ultrasonically bonded copper wires

In this work we report on a reliability investigation regarding heavy copper wires ultrasonically bonded onto active braze copper substrates. The results obtained from both a non-destructive approach using 3D X-ray tomography and shear tests showed no discernible degradation or wear out from initial...

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Bibliographic Details
Main Authors:	Arjmand, Elaheh, Agyakwa, Pearl A., Corfield, Martin R., Li, Jianfeng, Mouawad, Bassem, Mark Johnson, C.
Format:	Article
Published:	Elsevier 2016
Subjects:	Heavy copper wire bonding; Reliability; Power electronics; Passive thermal cycling; Hardness
Online Access:	https://eprints.nottingham.ac.uk/37320/

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