A thermal cycling reliability study of ultrasonically bonded copper wires
In this work we report on a reliability investigation regarding heavy copper wires ultrasonically bonded onto active braze copper substrates. The results obtained from both a non-destructive approach using 3D X-ray tomography and shear tests showed no discernible degradation or wear out from initial...
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| Format: | Article |
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Elsevier
2016
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| Online Access: | https://eprints.nottingham.ac.uk/37320/ |
| _version_ | 1848795434578870272 |
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| author | Arjmand, Elaheh Agyakwa, Pearl A. Corfield, Martin R. Li, Jianfeng Mouawad, Bassem Mark Johnson, C. |
| author_facet | Arjmand, Elaheh Agyakwa, Pearl A. Corfield, Martin R. Li, Jianfeng Mouawad, Bassem Mark Johnson, C. |
| author_sort | Arjmand, Elaheh |
| building | Nottingham Research Data Repository |
| collection | Online Access |
| description | In this work we report on a reliability investigation regarding heavy copper wires ultrasonically bonded onto active braze copper substrates. The results obtained from both a non-destructive approach using 3D X-ray tomography and shear tests showed no discernible degradation or wear out from initial conditions to 2900 passive thermal cycles from − 55 to 125 °C. Instead, an apparent increase in shear strength is observed as the number of thermal cycles increases. Nanoindentation hardness investigations suggest the occurrence of cyclic hardening. Microstructural investigations of the interfacial morphologies before and after cycling and after shear testing are also presented and discussed. |
| first_indexed | 2025-11-14T19:32:02Z |
| format | Article |
| id | nottingham-37320 |
| institution | University of Nottingham Malaysia Campus |
| institution_category | Local University |
| last_indexed | 2025-11-14T19:32:02Z |
| publishDate | 2016 |
| publisher | Elsevier |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | nottingham-373202020-05-04T20:03:04Z https://eprints.nottingham.ac.uk/37320/ A thermal cycling reliability study of ultrasonically bonded copper wires Arjmand, Elaheh Agyakwa, Pearl A. Corfield, Martin R. Li, Jianfeng Mouawad, Bassem Mark Johnson, C. In this work we report on a reliability investigation regarding heavy copper wires ultrasonically bonded onto active braze copper substrates. The results obtained from both a non-destructive approach using 3D X-ray tomography and shear tests showed no discernible degradation or wear out from initial conditions to 2900 passive thermal cycles from − 55 to 125 °C. Instead, an apparent increase in shear strength is observed as the number of thermal cycles increases. Nanoindentation hardness investigations suggest the occurrence of cyclic hardening. Microstructural investigations of the interfacial morphologies before and after cycling and after shear testing are also presented and discussed. Elsevier 2016-04 Article PeerReviewed Arjmand, Elaheh, Agyakwa, Pearl A., Corfield, Martin R., Li, Jianfeng, Mouawad, Bassem and Mark Johnson, C. (2016) A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectronics Reliability, 59 . pp. 126-133. ISSN 0026-2714 Heavy copper wire bonding; Reliability; Power electronics; Passive thermal cycling; Hardness http://www.sciencedirect.com/science/article/pii/S0026271416300099 doi:10.1016/j.microrel.2016.01.009 doi:10.1016/j.microrel.2016.01.009 |
| spellingShingle | Heavy copper wire bonding; Reliability; Power electronics; Passive thermal cycling; Hardness Arjmand, Elaheh Agyakwa, Pearl A. Corfield, Martin R. Li, Jianfeng Mouawad, Bassem Mark Johnson, C. A thermal cycling reliability study of ultrasonically bonded copper wires |
| title | A thermal cycling reliability study of ultrasonically bonded copper wires |
| title_full | A thermal cycling reliability study of ultrasonically bonded copper wires |
| title_fullStr | A thermal cycling reliability study of ultrasonically bonded copper wires |
| title_full_unstemmed | A thermal cycling reliability study of ultrasonically bonded copper wires |
| title_short | A thermal cycling reliability study of ultrasonically bonded copper wires |
| title_sort | thermal cycling reliability study of ultrasonically bonded copper wires |
| topic | Heavy copper wire bonding; Reliability; Power electronics; Passive thermal cycling; Hardness |
| url | https://eprints.nottingham.ac.uk/37320/ https://eprints.nottingham.ac.uk/37320/ https://eprints.nottingham.ac.uk/37320/ |