APA (7th ed.) Citation

Arjmand, E., Agyakwa, P. A., Corfield, M. R., Li, J., Mouawad, B., & Mark Johnson, C. (2016). A thermal cycling reliability study of ultrasonically bonded copper wires. Elsevier.

Chicago Style (17th ed.) Citation

Arjmand, Elaheh, Pearl A. Agyakwa, Martin R. Corfield, Jianfeng Li, Bassem Mouawad, and C. Mark Johnson. A Thermal Cycling Reliability Study of Ultrasonically Bonded Copper Wires. Elsevier, 2016.

MLA (9th ed.) Citation

Arjmand, Elaheh, et al. A Thermal Cycling Reliability Study of Ultrasonically Bonded Copper Wires. Elsevier, 2016.