Hybrid half-bridge package for high voltage application

QR Code

Hybrid half-bridge package for high voltage application

3D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a hybrid half-bridge in a 3D packaging configuration, dedicated for high voltage application. A dynamic electrical test of the package is prese...

Full description

Bibliographic Details
Main Authors:	Mouawad, Bassem, Li, Jianfeng, Castellazzi, Alberto, Johnson, Christopher Mark
Format:	Conference or Workshop Item
Published:	2015
Subjects:	Half-Bridge 3-D Packaging Power Electronics High Voltage Si IGBT SiC Diodes
Online Access:	https://eprints.nottingham.ac.uk/37314/

Similar Items

3.3 kV SiC JBS diode configurable rectifier module
by: Mouawad, Bassem, et al.
Published: (2017)

Dynamic performance analysis of a 3.3 kV SiC MOSFET half-bridge module with parallel chips and body-diode freewheeling
by: Hussein, Abdallah, et al.
Published: (2018)

Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules
by: Ortiz Gonzalez, J., et al.
Published: (2016)

Experimental and analytical performance evaluation of SiC power devices in the matrix converter
by: Safari, Saeed, et al.
Published: (2014)

Low parasitic inductance multi-chip SiC devices packaging technology
by: Li, Jianfeng, et al.
Published: (2016)

High temperature pulsed-gate robustness testing of SiC power MOSFETs
by: Fayyaz, A., et al.
Published: (2015)

Built-in reliability design of a high-frequency SiC MOSFET power module
by: Li, Jianfeng, et al.
Published: (2014)

Testing of a lightweight SiC power module for avionic applications
by: Gurpinar, Emre, et al.
Published: (2014)

Design and development of a high-density, high-speed 10 kV SiC MOSFET module
by: Di Marino, Christina, et al.
Published: (2017)

Robust snubberless soft-switching power converter using SiC power MOSFETs and bespoke thermal design
by: Giuliani, F., et al.
Published: (2014)

SiC power MOSFETs performance, robustness and technology maturity
by: Castellazzi, Alberto, et al.
Published: (2016)

Full SiC Version of the EDA5 Inverter
by: Chowdhury, Shajjad, et al.
Published: (2017)

High-frequency modulated secondary-side self-powered isolated gate driver for full range PWM operation of SiC power MOSFETs
by: Garcia, Jorge, et al.
Published: (2017)

SiC polytypes and doping nature effects on electrical properties of ZnO-SiC Schottky diodes
by: Rebaoui, Z., et al.
Published: (2017)

SiC/GaN power semiconductor devices theoretical comparison and experimental evaluation
by: Li, Ke, et al.
Published: (2016)

Static and dynamic TSEPs of SiC and GaN transistors
by: Zhu, Siwei, et al.
Published: (2018)

Single pulse avalanche robustness and repetitive stress ageing of SiC power MOSFETs
by: Fayyaz, A., et al.
Published: (2014)

Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles
by: Li, Jianfeng, et al.
Published: (2015)

Integrated bi-directional SiC MOSFET power switches for efficient, power dense and reliable matrix converter assembly
by: Lasserre, Philippe, et al.
Published: (2016)

Modular integrated SiC MOSFET matrix converter
by: Aliyu, Attahir Murtala, et al.
Published: (2017)

A physical RC network model for electro-thermal analysis of a multichip SiC power module
by: Li, Jianfeng, et al.
Published: (2017)

The Resonant Half Bridge Dual Converter with a Resonant Gate Drive
by: Li, Q., et al.
Published: (2004)

Optimization of thermal management and power density of small-scale wind turbine applications using SiC-MOSFETs
by: Hussein, Abdallah, et al.
Published: (2017)

Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors
by: Yang, Li, et al.
Published: (2018)

Detection of Amorphous Silica in Air-Oxidized Ti3SiC2 at 500-1000°C
by: Pang, W., et al.
Published: (2010)

Diffraction Study on the Thermal Stability of Ti3SiC2/TiC/TiSi2 Composites in Vacuum
by: Pang, Wei Kong, et al.
Published: (2010)

Silicon carbide MOSFETs in more electric aircraft power converters: the performance and reliability benefits over silicon IGBTs for a specified flight mission profile
by: O'Donnell, Shane, et al.
Published: (2016)

Integrated half-bridge switch using 70-μm-thin devices and hollow interconnects
by: Solomon, Adane Kassa, et al.
Published: (2015)

Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers
by: Aliyu, Attahir Murtala, et al.
Published: (2017)

SiC-based power electronics for wind energy applications
by: Hussein, Abdallah Suliman
Published: (2019)

Enhancing optoelectronic properties of SiC-grown graphene by a surface layer of colloidal quantum dots
by: Makarovsky, Oleg, et al.
Published: (2017)

A comprehensive study of the short-circuit ruggedness of silicon carbide power MOSFETs
by: Romano, Gianpaolo, et al.
Published: (2016)

Deformation-induced phase transformation in 4H-SiC nanopillars
by: Chen, B., et al.
Published: (2014)

Mechanical and thermodynamic properties of the monoclinic andorthorhombic phases of SiC2N4 under high pressurefrom first principles*
by: Miao, N., et al.
Published: (2014)

Influence of design parameters on the short-circuit ruggedness of SiC Power MOSFETs
by: Romano, Gianpaolo, et al.
Published: (2016)

Using multi time-scale electro-thermal simulation approach to evaluate SiC-MOSFET power C=converter in virtual prototyping design tool
by: Li, Ke, et al.
Published: (2017)

Social Credibility Incorporating Semantic Analysis and Machine Learning: A Survey of the State-of-the-Art and Future Research Directions
by: Abu Salih, Bilal, et al.
Published: (2019)

Multidomain modelling of multichip SiC power modules
by: Olanrewaju, Olufisayo Abimbola
Published: (2020)

Reliable integration of a high performance multi-chip half-bridge SiC power module
by: Mouawad, Bassem, et al.
Published: (2016)

Core–shell SiCw@TiC composite whisker-reinforced Al2O3 ceramics: Preparation, properties, and toughening mechanisms
by: Li, W., et al.
Published: (2025)