Hybrid half-bridge package for high voltage application
3D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a hybrid half-bridge in a 3D packaging configuration, dedicated for high voltage application. A dynamic electrical test of the package is prese...
| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2015
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| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/37314/ |
| _version_ | 1848795432751202304 |
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| author | Mouawad, Bassem Li, Jianfeng Castellazzi, Alberto Johnson, Christopher Mark |
| author_facet | Mouawad, Bassem Li, Jianfeng Castellazzi, Alberto Johnson, Christopher Mark |
| author_sort | Mouawad, Bassem |
| building | Nottingham Research Data Repository |
| collection | Online Access |
| description | 3D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a hybrid half-bridge in a 3D packaging configuration, dedicated for high voltage application. A dynamic electrical test of the package is presented. |
| first_indexed | 2025-11-14T19:32:00Z |
| format | Conference or Workshop Item |
| id | nottingham-37314 |
| institution | University of Nottingham Malaysia Campus |
| institution_category | Local University |
| last_indexed | 2025-11-14T19:32:00Z |
| publishDate | 2015 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | nottingham-373142020-05-04T17:26:52Z https://eprints.nottingham.ac.uk/37314/ Hybrid half-bridge package for high voltage application Mouawad, Bassem Li, Jianfeng Castellazzi, Alberto Johnson, Christopher Mark 3D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a hybrid half-bridge in a 3D packaging configuration, dedicated for high voltage application. A dynamic electrical test of the package is presented. 2015-12-14 Conference or Workshop Item PeerReviewed Mouawad, Bassem, Li, Jianfeng, Castellazzi, Alberto and Johnson, Christopher Mark (2015) Hybrid half-bridge package for high voltage application. In: 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 12-16 June 2016, Prague, Czech Republic. Half-Bridge 3-D Packaging Power Electronics High Voltage Si IGBT SiC Diodes http://ieeexplore.ieee.org/document/7520799/?arnumber=7520799 |
| spellingShingle | Half-Bridge 3-D Packaging Power Electronics High Voltage Si IGBT SiC Diodes Mouawad, Bassem Li, Jianfeng Castellazzi, Alberto Johnson, Christopher Mark Hybrid half-bridge package for high voltage application |
| title | Hybrid half-bridge package for high voltage application |
| title_full | Hybrid half-bridge package for high voltage application |
| title_fullStr | Hybrid half-bridge package for high voltage application |
| title_full_unstemmed | Hybrid half-bridge package for high voltage application |
| title_short | Hybrid half-bridge package for high voltage application |
| title_sort | hybrid half-bridge package for high voltage application |
| topic | Half-Bridge 3-D Packaging Power Electronics High Voltage Si IGBT SiC Diodes |
| url | https://eprints.nottingham.ac.uk/37314/ https://eprints.nottingham.ac.uk/37314/ |