Characterization and reliability of Ag nanoparticle sintered joint for power electronics modules

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Characterization and reliability of Ag nanoparticle sintered joint for power electronics modules

Nowadays, numerous power electronics application requires operation at high temperatures. In order to address increasing change of reliability problems in power die attachments for high temperature and high reliability applications, sintering Ag nanoparticles has been used as bonding material for th...

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Bibliographic Details
Main Author:	Wang, Yun
Format:	Thesis (University of Nottingham only)
Language:	English
Published:	2016
Subjects:	Power electronics Equipment and supplies Nanoparticles Sintering Silver Solder and soldering
Online Access:	https://eprints.nottingham.ac.uk/37296/

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